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KATON®-TPF® CRYSTAL O-ring is a high-purity FKM, with typical characteristics including a transparent material that, compared to traditional FKM, offers improved resistance to free radicals and lower adhesion to metal surfaces, enhancing resistance to metals and free radicals.

 

It is suitable for use in dry etching plasma equipment seals for semiconductor and LCD devices, ozone generation, and plasma-enhanced CVD equipment.

 

 

KATON® PF92T is TPF fluoroelastomers (thermoplastic TPF fluoroelastomer) designed for high performance applications where both purity and chemical resistance are required, mainly for semiconductor manufacturing applications.
 
KATON® PF92T Para-bridging structure filler: it reinforces the materials without the use of conventional contaminating fillers, such as carbon black or minerals. Mineral fillers such as BaSO4, TiO2, SiO2, aluminum oxide and aluminum silicate exhibit high plasma resistance: they can therefore shield the polymer, but may contaminate the chamber by leaving discrete particles as soon as the polymer is etched by plasma. On the other hand, thermoplastic and fluoroelastomer have similar etching rates, so that polymeric filled compounds can be completely etched to form volatiles, significantly reducing the potential for particle generation.

They are suitable for applications at temperatures ranging from –10 °C to 230°C. Their extreme cleanliness along with their good plasma and chemical resistance make KATON® PF92T and PF92T the suitable sealing materials for most dry (plasma etching, PECVD, LPCVD, metal CVD, PVD, ALD, plasma cleans) and wet semiconductor processes (wafer cleaning, polymer removal, wet etching, polishing).

The primary use for KATON® PF92T is the manufacturing of any kind of elastomeric sealing element such as chamber seals, lid seals, window seals, gas inlet seals, fitting seals, slit valve gates, lip seals, wafer handling parts, etc. used in the semiconductor industry.
 
KATON® PF92T can be combined with the cure system and other typical fluoroelastomer compounding ingredients; their mixing can be accomplished with two roll mills or internal mixers. Finished goods may be produced by a variety of rubber processing methods. If only liquid peroxide is added to the polymers during the compounding stage, translucent items are produced.

The main properties of KATON® PF92T Series are as follows:
• High purity (low amount of extractables)
• Very good oxygen and fluorine plasma resistance
• Very low particle generation
• Low out gassing
• Low friction
• High abrasion resistance
• Low modulus
• Excellent mechanical and sealing properties

KATON TPF FKM O-RING

  • KATON® PF92T is TPF fluoroelastomers (thermoplastic TPF fluoroelastomer) designed for high performance applications where both purity and chemical resistance are required, mainly for semiconductor manufacturing applications.

  • Fluorine content: ±3% (tested in non-filled material state)

    70

    Usage above 300°C for high-temperature applications

     

    Usage below -40°C for ultra-low-temperature applications

     

    Resistant to weak acids, bases, and aromatic hydrocarbons

    Resistant to moderate acids, bases, weak ketones, and ether organic solvents

    Resistant to strong acids, ammonia, high pH, and corrosive environments

     

    Resistant to high concentrations of ketones, ethers, esters, and phenol organic solvents

     

    Resistant to aromatic hydrocarbons, toluene, and alcohol-based organic solvents

     

    Steam, hot water, and mineral acid resistance

     

    Permeability to FUEL-C fuel

     

    Resistant to vehicle fuels and gasoline additives like ETOH and MTBE

    Resistant to engine lubricating oils (SG, SH grades)

    Compatible with hydraulic oils, mineral oils, synthetic oils, and transmission oils

    Compatible with brake fluids

    Suitable for refrigerant systems

    High tensile strength, tear, and break resistance

     

    Resistant to compression set

    Low friction coefficient

    Suitable for high-pressure industrial machinery applications

     

    Suitable for AED (Anti-Explosive Decompression) applications in ultra-high pressure oil wells

     

    Suitable for high-purity, zero-contaminant applications in semiconductors

    Resistant to semiconductor plasma

    Resistant to high concentrations of O2 and O3 gases

    Suitable for semiconductor plasma processes with high concentrations of O2 and O3 gases

    Suitable for front-end semiconductor ETCH process applications

    Suitable for front-end semiconductor CVD process applications

    Suitable for processes involving the emission of exhaust gases in front-end semiconductor production

    Food processing equipment with detectable metal-filled heat exchangers

     

    Food processing equipment with FDA-compliant, high-purity, sterilization processes

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