KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance. The monomer composition of KATON® FEPM AFLAS is virtually identical to KATON® FEPM AFLAS, but due to optimized polymer architecture, compounds based on KATON® FEPM AFLAS exhibit the following:
• Faster cure rates
• Improved flow at high shear rates
• Slightly higher tensile strength
• Improved resistance to compression set
• Equivalent fluid and chemical resistance
KATON AFLAS FEPM-P O-RING | Oil Machinery + High pressure
KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance.
Fluorine content: ±3% (tested in non-filled material state)
57 Usage above 300°C for high-temperature applications
Usage below -40°C for ultra-low-temperature applications
Resistant to weak acids, bases, and aromatic hydrocarbons
✔ Resistant to moderate acids, bases, weak ketones, and ether organic solvents
✔ Resistant to strong acids, ammonia, high pH, and corrosive environments
✔ Resistant to high concentrations of ketones, ethers, esters, and phenol organic solvents
Resistant to aromatic hydrocarbons, toluene, and alcohol-based organic solvents
✔ Steam, hot water, and mineral acid resistance
✔ Permeability to FUEL-C fuel
✔ Resistant to vehicle fuels and gasoline additives like ETOH and MTBE
✔ Resistant to engine lubricating oils (SG, SH grades)
✔ Compatible with hydraulic oils, mineral oils, synthetic oils, and transmission oils
✔ Compatible with brake fluids
✔ Suitable for refrigerant systems
✔ High tensile strength, tear, and break resistance
✔ Resistant to compression set
✔ Low friction coefficient
Suitable for high-pressure industrial machinery applications
✔ Suitable for AED (Anti-Explosive Decompression) applications in ultra-high pressure oil wells
✔ Suitable for high-purity, zero-contaminant applications in semiconductors
Resistant to semiconductor plasma
✔ Resistant to high concentrations of O2 and O3 gases
Suitable for semiconductor plasma processes with high concentrations of O2 and O3 gases
Suitable for front-end semiconductor ETCH process applications
✔ Suitable for front-end semiconductor CVD process applications
Suitable for processes involving the emission of exhaust gases in front-end semiconductor production
✔ Food processing equipment with detectable metal-filled heat exchangers
Food processing equipment with FDA-compliant, high-purity, sterilization processes
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