KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance. The monomer composition of KATON® FEPM AFLAS is virtually identical to KATON® FEPM AFLAS, but due to optimized polymer architecture, compounds based on KATON® FEPM AFLAS exhibit the following:
• Faster cure rates
• Improved flow at high shear rates
• Slightly higher tensile strength
• Improved resistance to compression set
• Equivalent fluid and chemical resistance
KATON AFLAS FEPM-P O-RING | High Steam + Alkali Resistance
KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance.
Fluorine content: ±3% (tested in non-filled material state)
57 Usage above 300°C for high-temperature applications
Usage below -40°C for ultra-low-temperature applications
Resistant to weak acids, bases, and aromatic hydrocarbons
✔ Resistant to moderate acids, bases, weak ketones, and ether organic solvents
✔ Resistant to strong acids, ammonia, high pH, and corrosive environments
✔ Resistant to high concentrations of ketones, ethers, esters, and phenol organic solvents
Resistant to aromatic hydrocarbons, toluene, and alcohol-based organic solvents
✔ Steam, hot water, and mineral acid resistance
✔ Permeability to FUEL-C fuel
✔ Resistant to vehicle fuels and gasoline additives like ETOH and MTBE
✔ Resistant to engine lubricating oils (SG, SH grades)
✔ Compatible with hydraulic oils, mineral oils, synthetic oils, and transmission oils
✔ Compatible with brake fluids
✔ Suitable for refrigerant systems
✔ High tensile strength, tear, and break resistance
✔ Resistant to compression set
✔ Low friction coefficient
Suitable for high-pressure industrial machinery applications
Suitable for AED (Anti-Explosive Decompression) applications in ultra-high pressure oil wells
Suitable for high-purity, zero-contaminant applications in semiconductors
Resistant to semiconductor plasma
Resistant to high concentrations of O2 and O3 gases
Suitable for semiconductor plasma processes with high concentrations of O2 and O3 gases
Suitable for front-end semiconductor ETCH process applications
Suitable for front-end semiconductor CVD process applications
Suitable for processes involving the emission of exhaust gases in front-end semiconductor production
✔ Food processing equipment with detectable metal-filled heat exchangers
Food processing equipment with FDA-compliant, high-purity, sterilization processes
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