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KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance. The monomer composition of KATON® FEPM AFLAS is virtually identical to KATON® FEPM AFLAS, but due to optimized polymer architecture, compounds based on KATON® FEPM AFLAS exhibit the following:

• Faster cure rates
• Improved flow at high shear rates
• Slightly higher tensile strength
• Improved resistance to compression set
• Equivalent fluid and chemical resistance

KATON AFLAS FEPM-P O-RING | High Steam + Alkali Resistance

  • KATON® FEPM AFLAS is an improved processing version of KATON® FEPM signed to match KATON® FEPM AFLAS closely as possible in terms of fluid resistance.

  • Fluorine content: ±3% (tested in non-filled material state)

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    Usage above 300°C for high-temperature applications

     

    Usage below -40°C for ultra-low-temperature applications

     

    Resistant to weak acids, bases, and aromatic hydrocarbons

    Resistant to moderate acids, bases, weak ketones, and ether organic solvents

    Resistant to strong acids, ammonia, high pH, and corrosive environments

    Resistant to high concentrations of ketones, ethers, esters, and phenol organic solvents

     

    Resistant to aromatic hydrocarbons, toluene, and alcohol-based organic solvents

    Steam, hot water, and mineral acid resistance

    Permeability to FUEL-C fuel

    Resistant to vehicle fuels and gasoline additives like ETOH and MTBE

    Resistant to engine lubricating oils (SG, SH grades)

    Compatible with hydraulic oils, mineral oils, synthetic oils, and transmission oils

    Compatible with brake fluids

    Suitable for refrigerant systems

    High tensile strength, tear, and break resistance

    Resistant to compression set

    Low friction coefficient

     

    Suitable for high-pressure industrial machinery applications

     

    Suitable for AED (Anti-Explosive Decompression) applications in ultra-high pressure oil wells

     

    Suitable for high-purity, zero-contaminant applications in semiconductors

     

    Resistant to semiconductor plasma

     

    Resistant to high concentrations of O2 and O3 gases

     

    Suitable for semiconductor plasma processes with high concentrations of O2 and O3 gases

     

    Suitable for front-end semiconductor ETCH process applications

     

    Suitable for front-end semiconductor CVD process applications

     

    Suitable for processes involving the emission of exhaust gases in front-end semiconductor production

    Food processing equipment with detectable metal-filled heat exchangers

     

    Food processing equipment with FDA-compliant, high-purity, sterilization processes

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